Built here. Controlled here. Proven here.

We operate a 3,000 m² manufacturing facility with an annual capacity of 150 million units. The site includes nine workshops that manage the entire production process from raw wafers to finished devices.

Three Core Systems Ensure Exact Specifications

The accuracy of our final components depends directly on the stability of these core systems.
Frequency stability requires uniform control across all manufacturing phases. We deploy specialized Japanese systems to manage the most sensitive assembly steps.

Automated Vision-Guided Dispensing Systems

Integrating a high-precision vision system allows for micron-level tolerance control over crystal blank positioning and adhesive volume. This precise mechanical alignment prevents ESR drift and ensures long-term frequency stability.

High-Vacuum Seam Sealing Systems

Operating under high-vacuum conditions, this equipment seals the component package to eliminate trapped gases and internal contamination. The resulting environmental isolation prevents material oxidation, maintaining targeted electrical performance.

Sputtering Deposition Systems

Electrode deposition via sputtering produces films with precise thickness uniformity and strong surface adhesion. This specialized capability ensures tight frequency control and minimal ESR variation across all production lots.
When you ask how batch 100 compares to batch 1, the answer starts with the machines.

Materials Don’t Lie

Raw crystal quality determines final component performance. We control both material selection and manufacturing precision.

All incoming materials are verified for purity, defect density, cut-angle, and surface finish to ensure compliance with downstream specifications.

We source core components from Tier-1 suppliers, including Kyocera, NGK, Heraeus, and Nisshinbo. Alternative materials are adopted only after full qualification.

Small Package. Big Claims. Verifiable Numbers.

Manufacturing precision shows up in measurements. Here are three that matter.
What does all that equipment and material discipline actually deliver? Three numbers that manufacturing engineers ask about.
0.05 ps

Typical RMS Phase Jitter Control

Utilizing high-precision assembly systems allows us to manage crystal Q factor, power supply noise rejection, and package parasitics simultaneously. This manufacturing control delivers a 0.05 ps typical RMS phase jitter (12 kHz to 20 MHz) in footprints as small as 2.5 × 2.0 mm.
±10 to ±20 ppb

Miniaturized OCXO Thermal Integration

Producing a 9.7 × 7.5 mm OCXO requires uniform thermal control across a reduced volume. Our process relies on the precise mechanical alignment of the internal oven design, crystal platform, and assembly stress management to maintain a frequency stability of ±10 to ±20 ppb over temperature.

Extended Environmental Reliability Beyond Automotive Standards

While standard automotive qualification ranges from −40°C to +125°C, our manufacturing and sealing processes extend this thermal margin to −55°C and +150°C. This product-line-wide AEC-Q200 compliance ensures reliable operation under extreme conditions, including northern base station cold-starts and under-hood heavy machinery thermal soak.
These numbers come from production units, after full inspection. For details on how every unit is tested, see our quality systems.

Built by People Who’ve Done This Before

Automated lines establish our quality baseline, while our engineering team defines performance limits. Processes are managed by a Chief Engineer (12 years in oscillator design), Senior Engineers (low-jitter/OCXO), and Production Leads (10 years on fabrication lines).

We analyze production data directly to prevent process drift before shipment. The team monitors ESR histograms and temperature curves to intercept non-conforming components.

Customization is handled through direct engineering channels. Feasibility for custom frequencies or tighter specifications is evaluated within one business day, supporting small-batch validation starting at 5 pieces.

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