FCO-2C-LE Low-EMI Spread-Spectrum XO
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  • FCO-2C-LE Low-EMI Spread-Spectrum XO

FCO-2C-LE Low-EMI Spread-Spectrum XO

SMD 2.5×2.0mm, Low EMI, SSXO


FEATURE

FCO-2C-LE is a 2.5×2.0×0.81 mm low‑EMI SMD crystal oscillator featuring spread‑spectrum options (down −2.00~−0.80%, center ±0.40~±1.00%), 1.8/2.5/3.3 V operation, 16–40 MHz range, ≤5 ms start‑up, 45–55% duty, CMOS output, and OE tri‑state—ideal for IP cameras, LED modules, media players, and surveillance electronics.

Product Description

FCO-2C-LE — Low-EMI SMD CMOS Crystal Oscillator

Compact 2.5×2.0×0.81 mm XO with built-in spread-spectrum options to help pass EMC with margin. Designed for space-constrained clock trees where peak emissions and coupling into RF/IF paths can become the real bottleneck.

16–40 MHzfrequency range
1.8/2.5/3.3 VVdd options
≤ 5 msstart-up
45–55%duty cycle
~7–15 dBEMI reduction
CMOS15 pF load
FCO-2C-LE low-EMI spread-spectrum SMD CMOS crystal oscillator (2.5×2.0 mm)

FCO-2C-LE integrates spread-spectrum clocking to lower peak emissions and ease system-level EMC. It supports down spread and center spread options with a modulation carrier of 20–52 kHz, delivers CMOS output up to 15 pF loads, and operates from 1.8/2.5/3.3 V rails. It is commonly used in products that combine high-speed digital switching with sensitive RF or video paths—where a “cleaner” clock peak makes compliance and coexistence easier.

Learn the basics: what is a clock oscillator, how a quartz oscillator works, and oscillator electronics applications.

Key Features

  • Low-EMI spread-spectrum options to reduce peak emissions and improve EMC margin.
  • Fast start-up (≤ 5 ms) for quick boot, power cycling and standby-to-active transitions.
  • Multi-Vdd support (1.8 V / 2.5 V / 3.3 V) for modern SoC/PHY clock domains.
  • OE tri-state for power management and clock gating with predictable behavior.
  • Compact 2.5×2.0×0.81 mm footprint for dense layouts and short clock routes.

Unless otherwise noted: typical evaluation at 25 ± 5°C, 40–70% RH.

Detailed Specifications

Parameters Symbol 1.8 V 2.5 V 3.3 V Notes
Frequency Range F 16–40 MHz Standard 24/25 MHz options
Output Type / Load — CMOS / 15 pF —
Current Consumption (min/max) Icc 1.5 / 4 mA 2.5 / 5 mA 2.5 / 6 mA Vdd dependent
Rise / Fall Time Tr/Tf 5 ns / 5 ns @20%–80% Vdd
Standby Current (OE=GND) Icc(ST) ≤ 1.2 mA Tri-state disable
Output High / Low VoH / VoL ≥ 90% Vdd / ≤ 10% Vdd —
OE Enable / Disable Threshold VIH / VIL ≥ 70% Vdd / ≤ 30% Vdd Pin 1 input
Duty Cycle TH/T 45–55% —
Start-up Time Tosc ≤ 5 ms t=0 to 90% Vdd
Aging (first year) — ±3 ppm/year @25°C
Modulation Carrier Freq. Mf 20–52 kHz Reference F0

Test conditions unless noted: 25 ± 5°C, 40–70% RH.

Applications (and why low-EMI matters)

IP Camera
LED Module
Media Players
Surveillance
  • IP cameras: reduce clock-peak energy that can couple into RF modules and impact EMC tests.
  • LED modules: help control radiated emissions on long harnesses and high-current switching boards.
  • Media players: mitigate interference into tuners/audio paths while keeping clock integrity.
  • Surveillance electronics: predictable boot timing and lower emission peaks in dense multi-board systems.

More application guidance: oscillator clock applications, networking & storage clocking, oscillators in 5G telecom.

FCO-2C-LE application examples in IP cameras, LED modules, media players, and surveillance electronics

Frequency Stability vs. Temperature Range

Temperature Range ±25 ppm ±50 ppm
−20 ~ +70°C Available Available
−40 ~ +85°C Available Available
−40 ~ +105°C — Available
−40 ~ +125°C — Check availability

The table summarizes common options; contact sales for special requirements. For definitions of stability, duty cycle, and other terms, see our crystal oscillator parameter guide.

Related application notes:

Spread-Spectrum Options

Spread Type Values
Down Spread −2.00%, −1.50%, −1.00%, −0.80%
Center Spread ±1.00%, ±0.75%, ±0.50%, ±0.40%

Typical EMI reduction: ~7–15 dB when applied appropriately.

Design Notes

  • Place a 0.1 μF bypass capacitor as close as possible between Vdd and GND pads.
  • Keep the XO output trace short; avoid routing near aggressive switching nodes.
  • Confirm system timing margin when selecting spread type/amount and modulation carrier.
  • Comparing technologies? See crystal vs MEMS oscillators and Pierce oscillator basics.

Ordering Code / Options

Specify frequency, stability, temperature range, Vdd, spread type/amount, and output enable requirements. Example: FCO-2C-LE, 25.000 MHz, ±50 ppm, −40~+105°C, 3.3 V, Down −1.0%.

Selection Path / Upgrade Options

If you need a drop-in alternative, start here: FCO-2C (baseline), FCO-2C-HP (higher precision), FCO-2C-UP (ultra-low power), FCO-2C-WT (wide temperature), or browse the Low-EMI FCO-C-LE series. For selection fundamentals, see Crystal-Controlled Oscillators overview and what is an oscillator in electronics.

Compare Related Models

Documents & Downloads

Download the datasheet for full electrical limits, pin assignment, recommended land pattern, and ordering options. If you need compliance documentation for a project gate, include your target standard and test setup in the RFQ.

Helpful knowledge links: how crystal oscillators work, load capacitance & drive level, Barkhausen criterion tips.

FCO-2C-LE SMD CMOS crystal oscillator package drawing

Need a specific footprint or pinout confirmation? Send your PCB constraints to technical support.

FAQ

How does FCO-2C-LE reduce EMI?

It uses spread-spectrum clocking (down or center spread) to distribute spectral energy and lower peak emissions, typically improving EMC margin in real systems when the spread option is selected appropriately.

What spread-spectrum options are available?

Down spread: −2.00%, −1.50%, −1.00%, −0.80%. Center spread: ±1.00%, ±0.75%, ±0.50%, ±0.40%. Modulation carrier frequency is 20–52 kHz (ref F0).

What stability and temperature options can I choose?

±25 ppm is available over −20~+70°C and −40~+85°C. ±50 ppm is available over −20~+70°C, −40~+85°C, and −40~+105°C. Contact us for extended ranges.

Any layout recommendations?

Place a 0.1 μF bypass capacitor as close as possible between Vdd and GND pads. Keep the output trace short and avoid routing near aggressive switching nodes to reduce coupling.

How do I use the OE/tri-state pin?

Drive OE high (≥70% Vdd) to enable output; drive low (≤30% Vdd) to disable to high-impedance. Standby current depends on Vdd and configuration.

What is the MOQ and lead time?

MOQ and lead time depend on frequency, stability/temperature grade, voltage and spread option. We support samples and volume production; contact us for a fast RFQ with your target spec and quantity.

Can I get samples and engineering support?

Yes. We provide samples for evaluation and FAE support on spread selection, layout and EMC validation. Share your target standard (CISPR/EN class), board constraints and clock tree requirements.

Do you support customization (frequency, stability, packaging, labeling)?

Yes. We can customize frequency, stability/temperature grade, spread amount/type and packing/labeling. Provide your application constraints and compliance target for a recommended build.

Why is pricing not listed on the page?

This is a B2B part with multiple build options (frequency, grade, voltage, spread). Pricing is quote-based to match your exact configuration and volume. Use the RFQ form or contact us for a quick quote.

Need help choosing spread options for EMC?
Share your target frequency, Vdd, and CISPR/EN class—our engineers will suggest a drop-in build.

Support & Certifications

For application engineering support (clock tree, spread selection, layout review and EMC troubleshooting), contact our technical support team.

ISO certifications: ISO9001 · ISO14001

Specifications are subject to change; verify critical parameters with our sales/FAE team prior to ordering.

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