FCO-2C-WT 2.5×2.0mm Wide-Temp Oscillator
SMD 2.5×2.0mm, –55°C to +125°C
FEATURE
Product Description
FCO-2C-WT — Wide-Temp 2.5×2.0 mm SMD CMOS Oscillator
Ultra-rugged clock source for harsh environments: −55~+125°C options, 1.25–100 MHz, ≤1.0 ps RMS jitter, and OE tri-state for low-power designs. Built for industrial control, automotive under-hood, aerospace, and high-reliability embedded systems where clock integrity and temperature margin matter.
Key specs are typically verified at nominal Vdd and CL=15 pF. Jitter is specified over 12 kHz–20 MHz unless noted; request an RFQ if you need a specific test condition alignment.

Key Features
- Wide temperature: options up to −55~+125°C with matched stability bins.
- Low jitter: ≤1.0 ps RMS (12 kHz–20 MHz) for RF/SERDES/high-speed logic.
- Flexible supply: 1.8 / 2.5 / 3.3 V CMOS (15 pF load).
- Fast start: ≤2 ms start-up; 45–55% duty cycle.
- Low power: ≤10 mA @ ≤80 MHz (typ), ≤15 mA above 80 MHz.
- OE / Tri-state: Pin-1 enable for power budgeting and bus sharing.
- Extended temperature reduces clock drift and prevents timing margin collapse in under-hood and harsh industrial cabinets.
- Low RMS jitter protects SERDES eye opening and sampling margin in high-speed digital and RF front-ends.
- OE tri-state enables standby power strategies and shared clock trees without extra buffering.
Need selection help? Use the RFQ to specify frequency, ppm bin, temperature grade, Vdd, and quantity so we can confirm feasibility and lead time.
Applications
FCO-2C-WT is designed for systems that must boot reliably and maintain tight timing margin across wide thermal excursions. Typical use cases include:
- Oil & gas drilling / geothermal tools: high temperature soak, shock, and vibration.
- Automotive ECU (under-hood): thermal cycling, cold crank noise, and long mission time.
- Industrial instrumentation & control: PLCs, gateways, and remote I/O with noisy power rails.
- Commercial space & aerospace: harsh thermal profile and reliability-focused BOM.
- Extreme environment electronics: outdoor infrastructure and sealed enclosures.

- Boot + watchdog timing: fast start-up helps deterministic reset recovery and quick time-to-service.
- High-speed interfaces: low RMS jitter improves margin for Ethernet/PCIe/FPGA clocks (system-dependent).
- Noisy rails: robust decoupling practice keeps supply noise from modulating clock edges.
- Wide thermal drift: choosing the correct ppm bin per temperature grade prevents “hidden” timing failures during thermal sweeps.
For architectural background, see Oscillator & Clock Applications, Networking & Storage Clocks, and Oscillators in 5G Telecom.
Detailed Specifications
| Parameters | Symbol | Min. | Typ. | Max. | Unit | Notes |
|---|---|---|---|---|---|---|
| Frequency Range | F | 1.25 | — | 100 | MHz | |
| Supply Voltage | Vdd | — | 1.8 / 2.5 / 3.3 | — | V | Nominal options |
| Current Consumption (≤80 MHz) | Icc | — | — | 10 | mA | Max |
| Current Consumption (>80 MHz) | Icc | — | — | 15 | mA | Max |
| Rise / Fall Time (10–90%) | Tr / Tf | — | — | 5 | ns | CL = 15 pF |
| Output Load | CL | — | 15 | — | pF | CMOS |
| Output High / Low | VoH / VoL | 0.9×Vdd | — | 0.1×Vdd | V | CMOS levels |
| Period Jitter (pk) | — | — | — | 40 | ps | Max |
| RMS Phase Jitter | PJ | — | 0.2 | 1.0 | ps | 12 kHz–20 MHz |
| Duty Cycle | TH/T | 45 | — | 55 | % | |
| Start-up Time | Tosc | — | — | 2 | ms | Max |
| Aging (first year @25°C) | — | — | — | ±3 | ppm/yr |
Test conditions: 25 ± 5°C, 40–70% RH. Inclusive stability bins account for calibration @25°C, temperature range, supply and load variation, aging (1st year), shock and vibration.
| Stability (ppm) | −40~+85°C | −40~+105°C | −40~+125°C | −55~+125°C |
|---|---|---|---|---|
| ±30 | Available | Conditional | Not available | Not available |
| ±40 | Available | Available | Not available | Not available |
| ±50 | Available | Available | Conditional | Not available |
| ±100 | Available | Available | Available | Available |
Legend: Available Conditional Not available
| Pin 1 (OE) | Threshold | Function |
|---|---|---|
| VIH | ≥ 0.7 × Vdd | Output Enable |
| VIL | ≤ 0.3 × Vdd | Output Disable (High-Z) |
Design tip: place a 0.1 µF bypass capacitor close to Vdd–GND pads.
Mechanical & Footprint
- Package: 2.5 × 2.0 mm SMD, industry-standard pad layout.
- Output: CMOS, 15 pF load.
- Pin-1: OE (tri-state), Pin-2: GND, Pin-3: OUT, Pin-4: Vdd.
- Marking: Device code and lot ID (see datasheet drawing).
Ordering Code / Options
- Frequency: target MHz (1.25–100 MHz)
- Stability bin: ±30 / ±40 / ±50 / ±100 ppm
- Temperature grade: −40~+85°C / −40~+105°C / −40~+125°C / −55~+125°C
- Supply voltage: 1.8 V / 2.5 V / 3.3 V
- OE requirement: enable polarity and standby behavior
- Quantity & packaging: prototypes vs volume
Supply options vary by frequency and temperature grade. If you need conditional bins (e.g., ±30 ppm at −40~+105°C), call it out in the RFQ.
- Thermal margin first: pick the temperature grade that matches your worst-case enclosure/under-hood profile.
- Then ppm: choose the stability bin that protects protocol timing/baud rate/MCU clock tolerance across temperature.
- Then jitter: validate RMS jitter needs against your interface budget (SERDES/ADC/RF clocking).
- Power & OE: use OE tri-state for standby strategy and clock tree sharing.
For fundamentals, see What Is a Clock Oscillator?, How Crystal Oscillators Work, and Key Oscillator Parameters.
Documents & Downloads
- Datasheet (PDF): FCO-2C-WT wide temperature CMOS oscillator (2.5×2.0mm)
- Wide-temperature oscillator overview: Wide Temperature Oscillators
- Family landing pages: Crystal-Controlled Oscillator Guide
For compliance and management systems: ISO9001 and ISO14001.

If you need a specific pad stack or solder profile alignment, include your PCB constraints in the RFQ.
Selection Path / Upgrade Options
If your system is sensitive to interference or emissions, consider the low-EMI option. If your priority is tighter frequency tolerance across temperature, evaluate the high-precision option. For power-limited designs, check the ultra-low-power variant.
Order & Inquiry
Tell us your required frequency, stability, temperature range, Vdd, and quantity. Our team will confirm lead time and pricing.
Technical support: application engineering can help review clock-tree placement, decoupling, OE behavior, and temperature/stability trade-offs for your design constraints.
FAQ
What frequency-stability options are available across the wider temperature ranges?
How should I decouple the supply for best jitter performance?
How is output enable/disable controlled (OE / tri-state)?
Do you support samples and volume production?
What is the MOQ and typical lead time?
Can you customize output, temperature grade, or screening?
Can you provide test reports for harsh-environment programs?
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