FCX-2R Thermal Quartz Crystal (2.5×2.0mm)

Key Features

• Miniature 2.5 × 2.0 × 1.0 mm ceramic package
• Built-in thermistor (22kΩ or 100kΩ) for temperature feedback
• Nominal frequency range: 12 MHz to 54 MHz
• Frequency tolerance: ±10 ppm @25°C
• Frequency stability: ±10 ppm from –30°C to +85°C
• Load capacitance: 6pF / 7pF / 8pF (or custom)
• Operating temperature: –25°C to +85°C
• Storage temperature: –40°C to +125°C
• Drive level: Max 100μW
• ESR: Max 50Ω
• Aging: ±3 ppm/year
• RoHS and REACH compliant

Recommended Applications

• GNSS and GPS modules
• Smartphones and mobile devices
• Wearable electronics
• Environmental sensors and smart meters
• Bluetooth/Wi-Fi timing systems requiring thermal calibration

Electrical Characteristics

Package Dimension

Design Recommendations

Connect the integrated thermistor pins to an analog input or thermal compensation circuit as required. For optimal frequency stability, ensure proper load capacitance is matched with the target oscillator circuit. Avoid placing high-noise digital lines close to the crystal and keep PCB traces short to reduce parasitic effects. A 0.1μF bypass capacitor across the oscillator circuit may help suppress transient noise.

For more technical details or to request samples, visit www.fujicrystal.com or contact FCom@fujicrystal.com.

Thermal crystal materials represent a specialized category of engineered substances with periodically structured atomic lattices designed for thermal management applications. These materials demonstrate unique capabilities in controlling phonon transport through their precisely organized crystalline structures. The strategic arrangement of atoms in these crystals creates specific pathways for heat transfer that can be optimized for particular thermal management challenges. This fundamental characteristic distinguishes them from conventional amorphous or polycrystalline thermal interface materials, offering new possibilities for thermal design in advanced electronic systems.

A notable characteristic of certain thermal crystal configurations is their ability to provide anisotropic thermal conduction. This directional heat transfer capability allows designers to create preferential paths for heat dissipation while maintaining thermal isolation in other directions. Such controlled thermal transport proves valuable in multi-component systems where specific areas require efficient cooling while adjacent components benefit from thermal isolation. The predictable nature of heat flow through these crystalline structures enables more sophisticated thermal management strategies in compact electronic assemblies and integrated circuit designs.

The structural stability of thermal crystal materials across temperature variations presents another advantageous aspect. These materials typically maintain their thermal properties under demanding operational conditions, including elevated temperatures that might degrade conventional thermal compounds. This thermal resilience supports long-term reliability in applications experiencing significant thermal cycling or sustained high-temperature operation. The preservation of crystalline integrity under thermal stress contributes to consistent performance throughout product lifecycles.

Manufacturing processes for thermal crystal materials have evolved to support various industrial applications. Advanced fabrication techniques enable the production of crystalline thermal solutions in forms compatible with standard electronic assembly processes. These developments facilitate the integration of crystalline thermal management approaches into existing production workflows. The compatibility with conventional manufacturing methods enhances the practical implementation of these materials across consumer electronics, telecommunications equipment, and power conversion systems.

Research initiatives continue to explore potential applications for thermal crystal technologies in emerging fields. Investigations examine their implementation in energy systems, photonic devices, and advanced computing architectures where thermal management constraints influence overall system performance. The ongoing development of these materials suggests expanding opportunities for thermal management solutions that leverage crystalline structure advantages. These research directions indicate growing recognition of the value that structured thermal materials can bring to diverse technological applications.