1) What TWS Means—and Why the Crystal Matters
TWS (True Wireless Stereo) refers to a Bluetooth architecture where the left and right audio channels operate as truly wireless peers. To maintain synchronization across RF, baseband, and audio processing, the headset platform relies on a stable reference clock—typically provided by a small quartz crystal (passive chip crystal) connected to the Bluetooth SoC.
In practical terms, the reference crystal helps the chipset maintain predictable frequency accuracy and timing stability across temperature, battery conditions, and mechanical stress. This stability supports robust pairing, resilient wireless links, and consistent audio timing.
2) Practical Package & Frequency Choices for Earbuds
TWS earbuds are space-constrained, so compact SMD packages dominate: SMD2016 (2.0×1.6mm) and SMD1612 (1.6×1.2mm). These packages enable high-density layouts while meeting typical Bluetooth reference requirements.
The most common frequency for Bluetooth audio platforms is 26MHz, but several widely used chipsets and combo solutions adopt 24MHz, 37.4MHz, or 40MHz based on RF clock-tree and system integration needs. Always confirm the exact requirement in the chipset reference design.
Typical consumer target
Many consumer designs adopt ±10ppm stability for the primary reference crystal. The final requirement should be derived from the platform’s tolerance budget, temperature range, and RF performance margin.
3) TWS + ANC: Where Clock Quality Shows Up
ANC performance depends on stable sampling and deterministic DSP timing. A stable reference clock helps reduce timing drift between audio paths (feedforward/feedback microphones and speakers) and supports coherent processing across the ANC loop.
In other words: better reference stability contributes to predictable system timing, which supports consistent noise reduction under real-world conditions such as movement, temperature variation, and battery droop.
4) Compatibility Snapshot (Chipset ↔ Crystal)
The table below preserves the original compatibility mapping while presenting it in a cleaner, more readable format. Use it as a quick starting point, then validate all parameters (frequency, load capacitance, ESR, drive level) against the chipset design guide.
| IC Brand | IC Number | Package | FCom Series | Frequency |
|---|---|---|---|---|
| Airoha | AB1512 | 2016 SMD-4 | FCX-2S | 16 MHz |
| BES | BES2300 | 2016 SMD-4 | FCX-2S | 26 MHz |
| Broadcom | BCM43014 | 2016 SMD-4 | FCX-2S | 24 MHz |
| Broadcom | BCM43436 | 2016 SMD-4 | FCX-2S | 37.4 MHz |
| Cypress | CYW20745 | 2016 SMD-4 | FCX-2S | 26 MHz |
| Jieli Tech | AC6936D | 2016 SMD-4 | FCX-2S | 24 MHz |
| MTK | MT2811 | 2016 SMD-4 | FCX-2S | 26 MHz |
| Qualcomm | CSR8675 | 2016 SMD-4 | FCX-2S | 26 MHz |
| Qualcomm | QCC3026 | 2016 SMD-4 | FCX-2S | 26 MHz |
| Realtek | RTL8763B | 2012 SMD-2 | FCT-2M | 32.768 kHz |
| Realtek | RTL8763B | 2016 SMD-4 | FCX-2S | 40 MHz |
| Windtunnel | WT200 | 2016 SMD-4 | FCX-2S | 26 MHz |
Note: “2016” and “1612” commonly refer to package footprints in millimeters (2.0×1.6mm and 1.6×1.2mm). Final selection should also match the required load capacitance (CL), ESR, drive level, and operating temperature range of the chipset design.
5) Selection Checklist for TWS Designers
- Frequency: Follow the chipset reference design (26MHz is common; 24/37.4/40MHz also appear in practice).
- Stability: ±10ppm is typical in consumer designs; tighten if the platform and RF margin require it.
- Aging: Lower aging supports longer-term frequency accuracy and reduces recalibration burden.
- Low power & start-up behavior: Important for always-on states and fast wake transitions.
- Mechanical robustness: Earbuds experience shock and vibration; packaging and mounting quality matter.
FAQ
Why does a TWS Bluetooth SoC need an external crystal?
Is 26MHz always the right frequency for TWS earbuds?
What stability level is typically used in consumer TWS designs?
How does the crystal relate to ANC performance?
Which packages are most common for TWS crystals?
Engineering disclaimer: Compatibility lists are provided for reference only. Confirm all electrical and mechanical requirements with the chipset vendor documentation and your final PCB/assembly constraints.



